At PACK EXPO 2023, Emerson and CoreTigo will present wireless floor-to-cloud packaging solutions

Emerson and CoreTigo are gearing up to unveil a groundbreaking chapter in the world of packaging solutions at the highly anticipated PACK EXPO 2023. This event will showcase a convergence of CoreTigo's IO-Link Wireless solutions and Emerson's cutting-edge automation technologies, heralding a new era of possibilities for packaging machine builders and manufacturers. These innovations are set to tackle critical challenges in the realm of Consumer-Packaged Goods and other demanding industries. This collaborative venture ushered in an era of unparalleled flexibility and agility for packaging machines. The incorporation of industrial-grade wireless connectivity, meticulously tailored for factory automation, has empowered packaging machinery with an array of control and monitoring capabilities.

This liberation of trapped data has bolstered production and brought forth several remarkable advantages:

1. Swift Changeovers: The integration of adaptive packaging machines, powered by IO-Link Wireless automation solutions, facilitates seamless transitions between different product and packaging variations. This groundbreaking innovation substantially reduces changeover times, thereby boosting overall efficiency and minimizing downtime.

2. Space-Efficient Design: Thanks to its compact and optimized design, the adaptive machine occupies less floor space and necessitates fewer external equipment and robotics. This streamlined layout fosters a more efficient and space-effective manufacturing environment.

3. Maximized Productivity: The adaptive packaging machine operates at peak capacity, ensuring that productivity and throughput are optimized to their fullest potential. This capability not only accelerates production but also maximizes the return on investment.

4. Unprecedented Flexibility: Offering unparalleled versatility, the adaptive machine accommodates multiple product and packaging types, catering to diverse production requirements. This adaptability empowers manufacturers to swiftly adapt to changing market demands without compromising efficiency.

5. Sustainability Focus: The collaborative efforts of Emerson and CoreTigo contribute to a more sustainable manufacturing process. Reduced energy consumption, minimized space requirements, and optimized part utilization make the adaptive machine a champion of eco-friendly practices and resource efficiency.

The unveiling of these cutting-edge innovations will take place at PACK EXPO 2023, scheduled for September 11-13, 2023. Visitors to the event will have the unique opportunity to witness firsthand the latest advancements in packaging machinery. Additionally, they can engage with representatives from Emerson and CoreTigo at Emerson's booth, located in the South Lower Hall, Booth 6107. This promises to be a momentous occasion in the world of packaging solutions, setting the stage for a more efficient, sustainable, and flexible future.